Profile
Hsiao Yu Lo is currently working as a Director at Siliconware Precision Industries Co., Ltd. since 2011.
Additionally, Dr. Lo is also currently serving as the President at Siliconware USA, Inc. Dr. Lo obtained a doctorate degree from Purdue University.
Hsiao Yu Lo active positions
| Companies | Position | Start |
|---|---|---|
Siliconware USA, Inc.
Siliconware USA, Inc. Marine ShippingTransportation The company is based in San Jose, CA. Part of ASE Technology Holding Co., Ltd., Siliconware USA, Inc. provides semiconductor assembly, packaging, testing, and wafer bumping services. The company offers backend IC manufacturing solutions, including advanced packaging technologies such as laminate substrate, leadframe, wafer-level chip scale packaging, stacked die, multi-package ball grid array, and 2.5D/3D integration with through-silicon vias. Its portfolio includes system-in-package, fan-out wafer-level packaging, flip chip, fine pitch wire bonding, molding, and antenna-in-package. Siliconware USA delivers in-house design capabilities, package characterization, reliability testing, and failure analysis. Wafer bumping services support both 200mm and 300mm wafers with various bumping technologies for semiconductor products like GPUs, PMICs, APs, high-performance computing chips, wireless devices, AI servers, IoT, and RFICs. The company serves markets such as computing, mobile devices, telecommunications, consumer electronics, automotive, AI, VR/AR, and IoT. Its operations include certified clean rooms and automated environmental controls. | President | - |
Former positions of Hsiao Yu Lo
| Companies | Position | End |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO, LTD | Director/Board Member | - |
Training of Hsiao Yu Lo
Experiences
Positions held
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Private companies
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1st degree connections
1st degree companies
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Members of the board
Executives
Linked companies
| Private companies | 3 |
|---|---|
Siliconware Precision Industries Co., Ltd.
Siliconware Precision Industries Co., Ltd. SemiconductorsElectronic Technology Operates as a semiconductors assembling and testing company | Electronic Technology |
Purdue University
Purdue University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
Siliconware USA, Inc.
Siliconware USA, Inc. Marine ShippingTransportation The company is based in San Jose, CA. Part of ASE Technology Holding Co., Ltd., Siliconware USA, Inc. provides semiconductor assembly, packaging, testing, and wafer bumping services. The company offers backend IC manufacturing solutions, including advanced packaging technologies such as laminate substrate, leadframe, wafer-level chip scale packaging, stacked die, multi-package ball grid array, and 2.5D/3D integration with through-silicon vias. Its portfolio includes system-in-package, fan-out wafer-level packaging, flip chip, fine pitch wire bonding, molding, and antenna-in-package. Siliconware USA delivers in-house design capabilities, package characterization, reliability testing, and failure analysis. Wafer bumping services support both 200mm and 300mm wafers with various bumping technologies for semiconductor products like GPUs, PMICs, APs, high-performance computing chips, wireless devices, AI servers, IoT, and RFICs. The company serves markets such as computing, mobile devices, telecommunications, consumer electronics, automotive, AI, VR/AR, and IoT. Its operations include certified clean rooms and automated environmental controls. | Transportation |
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