Valuation: Axcelis Technologies

Market Cap 3.92B 3.36B 3.15B 2.88B 5.4B 375B 5.47B 37.16B 14.49B 189B 14.73B 14.41B 624B P/E 2026 *
44.8x
P/E 2027 * 26.3x
Enterprise Value 3.92B 3.36B 3.15B 2.88B 5.4B 375B 5.47B 37.16B 14.49B 189B 14.73B 14.41B 624B EV / Sales 2026 *
4.44x
EV / Sales 2027 * 3.97x
Free-Float
99.32%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 55 11/05/2023
Director of Finance/CFO 53 12/03/2026
Chief Operating Officer - -
Director TitleAgeSince
Director/Board Member 72 01/05/2015
Director/Board Member 69 13/05/2015
Director/Board Member 55 11/05/2023
Change 5-day change 1-year change 3-year change Capi.($)
+0.04%-4.66%+133.05%+143.18% 675B
+1.12%-5.52%+213.75%+370.89% 393B
+0.50%-8.19%+170.17%+156.21% 155B
-0.51%-4.71%+309.06%+441.01% 81.07B
-0.67%-11.19%+63.70%+47.78% 21.95B
+0.54%-9.53%+118.88%+59.71% 19.8B
-0.84%-9.14%+128.04%+260.40% 15.43B
-1.84%-11.57%+170.35%+160.00% 14.39B
-1.18%-14.80%+108.63%+95.95% 12.49B
Average -0.32%-8.48%+157.29%+192.79% 154.28B
Weighted average by Cap. +0.32%-5.65%+169.13%+224.81%

Financials

2026 *2027 *
Net sales 884M 757M 708M 648M 1.22B 84.53B 1.23B 8.37B 3.26B 42.47B 3.32B 3.25B 140B 989M 847M 793M 725M 1.36B 94.61B 1.38B 9.36B 3.65B 47.52B 3.71B 3.63B 157B
Net income 77.88M 66.71M 62.42M 57.14M 107M 7.45B 109M 738M 288M 3.74B 292M 286M 12.38B 142M 121M 114M 104M 195M 13.56B 198M 1.34B 523M 6.81B 532M 521M 22.53B
Net Debt - -
Logo Axcelis Technologies
Axcelis Technologies, Inc. is primarily a producer of ion implantation equipment used in the fabrication of semiconductor chips in the United States, Europe, and Asia. The Company is focused on developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the enabling steps in the IC manufacturing process. The Company's products include High Current, Medium Energy, High Energy, Mid Current, and GSD Ovation. The Company's Purion H6 next generation high current ion implanters deliver process control by leveraging its spot beam architecture, optimized for the full spectrum of high-current applications. The Company's Purion H200 is its state-of-the-art single wafer high current medium energy implanter. Its Purion XE Series high energy ion implanters use RF Linear Accelerator (LINAC) technology. The Company's Purion M ion implanters offer the broadest spectrum of mid-current doses available.
Employees
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Global
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Quality
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