Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 60.55B 1.87B 1.62B 1.51B 1.39B 2.63B 178B 2.66B 17.77B 6.98B 89.12B 7.04B 6.88B 295B P/E 2026 *
20.1x
P/E 2027 * 13.7x
Enterprise Value 63.98B 1.98B 1.71B 1.6B 1.47B 2.77B 188B 2.81B 18.78B 7.37B 94.18B 7.43B 7.27B 312B EV / Sales 2026 *
2.12x
EV / Sales 2027 * 1.89x
Free-Float
77.34%
Yield 2026 *
1.44%
Yield 2027 * 2.4%
1 day+4.85%
1 week+6.79%
Current month+19.15%
1 month-17.62%
3 months+13.07%
6 months+53.64%
Current year+83.46%
1 week 65.7
Extreme 65.7
90.4
1 month 65.7
Extreme 65.7
125
Current year 46.8
Extreme 46.8
125
1 year 23.1
Extreme 23.1
125
3 years 21.3
Extreme 21.3
125
5 years 21.3
Extreme 21.3
125
10 years 20.15
Extreme 20.15
125
Manager TitleAgeSince
Director of Finance/CFO 54 01/10/2017
President 67 17/07/1997
Corporate Officer/Principal 60 17/04/2007
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 67 28/06/2007
Director/Board Member 64 03/06/2015
Change 5-day change 1-year change 3-year change Capi.($)
+4.85%+6.79%+225.80%+138.29% 1.78B
-0.46%+5.57%+143.33%+136.00% 651B
-3.25%+14.02%+212.39%+345.24% 398B
+3.26%+4.70%+160.40%+177.55% 164B
+1.37%+7.04%+302.03%+444.04% 79.27B
+5.85%+24.68%+222.15%+121.71% 25.09B
+0.68%+23.18%+97.54%+44.07% 22.05B
+4.74%-3.42%+136.34%+262.41% 15.69B
-4.03%+14.10%+183.95%+133.07% 14.31B
-3.60%+17.88%+140.98%+90.99% 13.88B
Average +1.13%+10.88%+182.49%+189.34% 138.46B
Weighted average by Cap. -0.36%+9.80%+175.38%+217.86%

Financials

2026 *2027 *
Net sales 30.22B 935M 810M 755M 694M 1.31B 88.91B 1.33B 8.87B 3.48B 44.49B 3.51B 3.43B 147B 34.72B 1.07B 930M 867M 798M 1.51B 102B 1.52B 10.19B 4B 51.11B 4.03B 3.95B 169B
Net income 3.05B 94.44M 81.8M 76.25M 70.13M 132M 8.98B 134M 896M 352M 4.49B 355M 347M 14.88B 4.5B 139M 121M 112M 103M 195M 13.24B 197M 1.32B 519M 6.63B 523M 512M 21.94B
Net Debt 3.44B 106M 92.06M 85.82M 78.93M 149M 10.11B 151M 1.01B 396M 5.06B 399M 390M 16.75B 5.24B 162M 140M 131M 120M 227M 15.42B 230M 1.54B 604M 7.72B 609M 596M 25.55B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Date Price Change Volume
05/08/26 NT$86.50 +4.85% 41,209,710
04/08/26 NT$82.50 +6.31% 39,268,066
03/08/26 NT$77.60 +6.89% 48,689,772
31/07/26 NT$72.60 +10.00% 8,999,473
30/07/26 NT$66.00 -9.47% 43,913,300
Trader
Investor
-
Global
-
Quality
-
ESG MSCI
A
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
3
Last Close Price
86.50TWD
Average target price
118.00TWD
Spread / Average Target
+36.42%

Quarterly revenue - Rate of surprise

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