Valuation: CHPMS TCHNLGS

Market Cap 80.15B 2.51B 2.22B 2.1B 1.9B 3.57B 241B 3.61B 25.19B 9.71B 123B 9.44B 9.24B 397B P/E 2026 *
24.6x
P/E 2027 * 17.3x
Enterprise Value 85.01B 2.67B 2.35B 2.23B 2.02B 3.79B 256B 3.82B 26.72B 10.3B 131B 10.02B 9.8B 421B EV / Sales 2026 *
2.81x
EV / Sales 2027 * 2.5x
Free-Float
77.34%
Yield 2026 *
1.92%
Yield 2027 * 3.08%
Manager TitleAgeSince
Chief Executive Officer 67 17/07/1997
Director of Finance/CFO 54 01/10/2017
Chief Operating Officer - 06/03/2012
Director TitleAgeSince
Chairman 67 17/07/1997
Director/Board Member 69 28/06/2007
Director/Board Member 70 17/06/2013
Change 5-day change 1-year change 3-year change Capi.($)
+0.20%+5.90%+93.84%+188.50% 697B
-0.38%+7.33%+148.69%+264.97% 406B
+0.66%+5.92%+143.07%+415.90% 405B
-0.36%+3.99%+81.11%+324.09% 256B
+2.69%+11.23%+122.88%+189.02% 166B
+1.03%+6.90%+126.21%+719.42% 156B
+2.33%+1.44%+324.77%+542.01% 94.8B
-2.07%-8.46%+34.20%+244.62% 68.02B
-1.09%+2.46%+189.69%+296.08% 63.01B
Average +0.36%+2.99%+140.50%+353.84% 256.92B
Weighted average by Cap. +0.39%+4.61%+125.29%+311.69%

Financials

2026 *2027 *
Net sales 30.3B 951M 839M 794M 720M 1.35B 91.22B 1.36B 9.52B 3.67B 46.58B 3.57B 3.49B 150B 35.27B 1.11B 977M 924M 838M 1.57B 106B 1.59B 11.08B 4.27B 54.22B 4.16B 4.06B 174B
Net income 3.28B 103M 90.82M 85.93M 77.93M 146M 9.88B 148M 1.03B 397M 5.04B 386M 378M 16.23B 4.7B 147M 130M 123M 112M 209M 14.14B 211M 1.48B 569M 7.22B 553M 541M 23.24B
Net Debt 4.86B 153M 135M 127M 116M 217M 14.65B 219M 1.53B 589M 7.48B 573M 561M 24.07B 8.02B 252M 222M 210M 191M 357M 24.14B 361M 2.52B 971M 12.33B 945M 924M 39.67B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Global
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Quality
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ESG MSCI
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