Valuation: Kinsus Interconnect Technology Corp.

Market Cap 375B 11.58B 10.17B 9.46B 8.68B 16.31B 1,115B 16.56B 112B 43.88B 548B 43.47B 42.54B 1,896B P/E 2026 *
67.8x
P/E 2027 * 30.7x
Enterprise Value 374B 11.56B 10.15B 9.44B 8.66B 16.28B 1,113B 16.53B 112B 43.79B 547B 43.38B 42.45B 1,892B EV / Sales 2026 *
6.97x
EV / Sales 2027 * 4.73x
Free-Float
60.37%
Yield 2026 *
0.65%
Yield 2027 * 1.54%
1 day-9.43%
1 week+2.60%
Current month-20.20%
1 month-10.79%
3 months+35.17%
6 months+241.83%
Current year+347.17%
1 week 704
Extreme 704
819
1 month 653
Extreme 653
939
Current year 151.5
Extreme 151.5
939
1 year 100
Extreme 100
939
3 years 60.8
Extreme 60.8
939
5 years 60.8
Extreme 60.8
939
10 years 30.3
Extreme 30.3
939
Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 01/08/2000
Chief Operating Officer - -
Director TitleAgeSince
Chairman 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - 01/09/2003
Change 5-day change 1-year change 3-year change Capi.($)
-9.43%+2.60%+611.00%+552.29% 11.58B
-3.23%+11.28%+162.24%+472.52% 185B
-0.98%+1.29%+33.05%+269.90% 109B
-3.61%-17.67%+275.60%+751.92% 53.62B
-6.67%+5.78%+378.37%+1,243.22% 52.67B
+0.96%+5.34% - - 48.55B
-6.36%+5.67%+540.46%+324.81% 42.54B
-1.38%-0.36%+152.17%+455.32% 33.48B
-3.73%-4.76%+47.89%+852.03% 32.65B
-3.04%-12.19%+126.52%+384.12% 31.89B
Average -3.75%+3.68%+258.59%+589.57% 60.08B
Weighted average by Cap. -3.07%+5.81%+197.53%+539.82%

Financials

2026 *2027 *
Net sales 53.67B 1.66B 1.46B 1.36B 1.24B 2.34B 160B 2.37B 16.09B 6.29B 78.54B 6.23B 6.09B 272B 78.09B 2.41B 2.12B 1.97B 1.81B 3.4B 232B 3.45B 23.41B 9.15B 114B 9.06B 8.87B 395B
Net income 5.29B 164M 144M 134M 123M 230M 15.75B 234M 1.59B 620M 7.74B 614M 601M 26.78B 11.71B 362M 318M 296M 271M 510M 34.85B 517M 3.51B 1.37B 17.13B 1.36B 1.33B 59.24B
Net Debt -772M -23.88M -20.97M -19.5M -17.9M -33.63M -2.3B -34.15M -232M -90.49M -1.13B -89.64M -87.71M -3.91B -5.43B -168M -147M -137M -126M -236M -16.17B -240M -1.63B -636M -7.95B -630M -617M -27.49B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
24/07/26 NT$711.00 -9.43% 14,224,914
23/07/26 NT$785.00 -1.38% 16,084,194
22/07/26 NT$796.00 +6.70% 25,561,416
21/07/26 NT$746.00 +9.87% 6,598,311
20/07/26 NT$679.00 -2.02% 23,743,793
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
12
Last Close Price
711.00TWD
Average target price
891.75TWD
Spread / Average Target
+25.42%

Quarterly revenue - Rate of surprise

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