Valuation: Kinsus Interconnect Technology Corp.

Market Cap 496B 15.29B 13.72B 12.67B 11.49B 21.48B 1,452B 21.74B 152B 60.33B 761B 57.4B 56.17B 2,414B P/E 2026 *
74.7x
P/E 2027 * 32.1x
Enterprise Value 503B 15.52B 13.93B 12.86B 11.66B 21.8B 1,474B 22.06B 154B 61.23B 773B 58.25B 57B 2,450B EV / Sales 2026 *
9.3x
EV / Sales 2027 * 6.06x
Free-Float
60.38%
Yield 2026 *
0.6%
Yield 2027 * 1.46%
1 day-4.56%
1 week-0.42%
Current month-2.99%
1 month-2.18%
3 months+32.54%
6 months+82.72%
Current year+491.82%
1 week 928
Extreme 928
1,065
1 month 928
Extreme 928
1,150
Current year 151.5
Extreme 151.5
1,150
1 year 125.5
Extreme 125.5
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-4.56%-0.42%+533.67%+889.48% 15.94B
+0.90%+0.68%+13.81%+438.12% 5,216B
+0.63%-0.21%+62.16%+350.28% 1,897B
+4.00%+2.38%-5.45%+308.33% 1,571B
+2.77%+3.65%+321.97%+1,314.71% 1,022B
+5.45%+4.77%+115.76%+481.00% 867B
+5.18%+9.65%+150.65%+1,025.94% 700B
+3.61%+2.24%+137.08%+163.76% 475B
+0.80%+6.65% - - 434B
+3.62%+11.21%+82.34%+115.84% 272B
Average +0.43%+0.63%+156.89%+565.28% 1,247B
Weighted average by Cap. +0.61%-0.16%+67.50%+501.54%

Financials

2026 *2027 *
Net sales 54.11B 1.67B 1.5B 1.38B 1.25B 2.34B 158B 2.37B 16.58B 6.58B 83.08B 6.26B 6.13B 263B 82.89B 2.56B 2.29B 2.12B 1.92B 3.59B 243B 3.63B 25.4B 10.09B 127B 9.6B 9.39B 404B
Net income 6.64B 205M 184M 170M 154M 287M 19.44B 291M 2.03B 807M 10.19B 768M 752M 32.31B 16.01B 494M 443M 409M 371M 693M 46.89B 702M 4.9B 1.95B 24.58B 1.85B 1.81B 77.94B
Net Debt 7.39B 228M 205M 189M 171M 320M 21.65B 324M 2.26B 899M 11.35B 855M 837M 35.98B 6.67B 206M 185M 170M 155M 289M 19.54B 292M 2.04B 812M 10.24B 772M 756M 32.48B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
27/10/26 NT$941.00 -4.56% 19,625,282
22/10/26 NT$986.00 -2.38% 19,629,047
21/10/26 NT$1,010.00 +6.88% 21,361,332
20/10/26 NT$945.00 -3.77% 12,630,519
Trader
Investor
Global
Quality
ESG MSCI
B
MarketScreener Ratings - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
941.00TWD
Average target price
1,156.38TWD
Spread / Average Target
+22.89%

Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - Kinsus Interconnect Technology Corp.
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