Valuation : Kinsus Interconnect Technology Corp.

Market Cap 436B 13.76B 11.84B 11.17B 10.18B 19.02B 1,316B 19.19B 133B 51.2B 668B 51.69B 50.56B 2,120B P/E 2026 *
78.1x
P/E 2027 * 33.5x
Enterprise Value 440B 13.89B 11.95B 11.27B 10.27B 19.19B 1,328B 19.37B 134B 51.66B 674B 52.16B 51.02B 2,140B EV / Sales 2026 *
8.34x
EV / Sales 2027 * 5.64x
Free-Float
60.38%
Yield 2026 *
0.57%
Yield 2027 * 1.38%
1 day+1.85%
1 week-2.36%
Current month+0.98%
1 month+0.49%
3 months+15.83%
6 months+212.67%
Current year+420.13%
1 week 766
Extreme 766
835
1 month 766
Extreme 766
960
Current year 151.5
Extreme 151.5
960
1 year 102
Extreme 102
960
3 years 60.8
Extreme 60.8
960
5 years 60.8
Extreme 60.8
960
10 years 30.3
Extreme 30.3
960
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 01/05/2022
Director of Finance/CFO - 01/08/2000
Director TitleAgeSince
Director/Board Member 65 01/09/2000
Chairman - 11/09/2000
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
+1.85%-2.36%+695.19%+662.21% 13.58B
+2.05%+10.41%+212.58%+565.73% 234B
-2.38%-7.03%+8.93%+220.13% 95.59B
0.00%-1.29%+338.78%+1,103.81% 61.13B
-1.18%+5.62%+195.11%+986.60% 53.26B
+0.10%+2.16%+636.30%+449.17% 51.7B
+2.35%+12.61%+125.53%+648.02% 38.91B
+0.29%+8.05%+115.39%+552.65% 36.58B
-1.52%+2.12%-11.39%+986.72% 33.33B
-0.65%+7.05%+83.85%+339.47% 31.8B
Average +0.09%+6.90%+240.03%+651.45% 65.02B
Weighted average by Cap. +0.39%+5.91%+208.39%+607.43%

Financials

2026 *2027 *
Net sales 52.75B 1.67B 1.43B 1.35B 1.23B 2.3B 159B 2.32B 16.1B 6.2B 80.8B 6.26B 6.12B 257B 78.56B 2.48B 2.13B 2.01B 1.83B 3.43B 237B 3.46B 23.98B 9.23B 120B 9.32B 9.11B 382B
Net income 5.4B 170M 147M 138M 126M 236M 16.3B 238M 1.65B 634M 8.27B 640M 626M 26.25B 12.92B 408M 351M 331M 302M 564M 39.01B 569M 3.94B 1.52B 19.78B 1.53B 1.5B 62.84B
Net Debt 3.98B 126M 108M 102M 92.91M 174M 12.02B 175M 1.21B 467M 6.09B 472M 462M 19.36B 7.33B 232M 199M 188M 171M 320M 22.15B 323M 2.24B 862M 11.23B 870M 851M 35.68B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
10/09/26 NT$827.00 +1.85% 13,652,140
09/09/26 NT$812.00 +1.50% 15,225,627
08/09/26 NT$800.00 -1.60% 11,072,227
07/09/26 NT$813.00 -0.73% 17,014,894
04/09/26 NT$819.00 +5.68% 19,778,741
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
827.00TWD
Average target price
952.77TWD
Spread / Average Target
+15.21%

Quarterly revenue - Rate of surprise

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