Valuation: Strasbaugh

Market Cap 10M 8.97M 8.2M 7.48M 14.1M 940M 14.54M 98.8M 39.4M 502M 37.53M 36.73M 1.58B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.86M 7.18M 6.55M 12.35M 823M 12.74M 86.55M 34.51M 439M 32.88M 32.17M 1.39B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
5 years 0
Extreme 1.0E-6
0
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 01/05/2007
Director TitleAgeSince
Chairman 76 01/05/2007
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 14
+2.69%-9.14%+47.40%+114.25% 547B
+4.22%-14.71%+44.61%+134.74% 264B
+8.23%-16.17%+25.79%+212.57% 250B
+6.69%-12.30%+16.05%+175.26% 180B
-4.99%-19.64%+40.36%+568.14% 128B
-5.60%-13.15%+25.96%+94.74% 118B
-7.87%-21.11%+130.63%+348.51% 70.69B
-0.18%+16.97%+35.35%+194.91% 61.03B
0.00%+18.86%+22.42%+129.09% 36.43B
Average +0.32%-9.83%+43.18%+219.14% 165.61B
Weighted average by Cap. +2.41%-14.38%+40.76%+185.94%

Financials

2008 2009
Net sales 9.55M 8.57M 7.83M 7.15M 13.47M 898M 13.89M 94.39M 37.64M 479M 35.86M 35.09M 1.51B 12.87M 11.55M 10.55M 9.63M 18.15M 1.21B 18.72M 127M 50.72M 646M 48.32M 47.28M 2.04B
Net income -4.51M -4.04M -3.7M -3.37M -6.36M -424M -6.56M -44.54M -17.76M -226M -16.92M -16.56M -714M -680K -610K -557K -509K -959K -63.92M -989K -6.72M -2.68M -34.11M -2.55M -2.5M -108M
Net Debt -0.19 -0.17 -0.15 -0.14 -0.27 -17.67 -0.27 -1.86 -0.74 -9.43 -0.71 -0.69 -29.77 -1.24 -1.11 -1.02 -0.93 -1.75 -116.56 -1.8 -12.25 -4.89 -62.2 -4.65 -4.55 -196.35
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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